软板16层、软硬结合板40层  嵌入式无源元件  射频与微波软结合

混合介质层压    HDI微孔2MIL    混合介质层压  1.5/1.5mil线路/间距

多种表面处理组合   软硬结合位环氧树脂点胶   铝基和铜基板散热处理

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